Showing results: 16 - 30 of 111 items found.
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Eurofins E&E
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Sentris -
OptoTherm, Inc.
Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Micro Magnetics
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Materials Analysis Technology Inc.
MA-tek provides wide span of materials analysis, structure analysis, surface analysis, and failure analysis. By technology segment, MA-tek provides 9 major service lines:1. Electrical Failure Analysis (EFA). 2. Physical Failure Analysis (PFA). 3. Structure Analysis. 4. Surface Analysis. 5. FIB Circuit Editing6. Reliability Testing. 7. Reverse Engineering of Benchmark Analysis. 8. IP Consultancy. 9. Quality Management Training Course.
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National Technical Systems
From cheap toys and smartphones to sophisticated computers and radar detector systems, printed circuit boards (PCB) are critical components for today’s electronic and industrial technology. Almost every electronic device has one of these self-contained modules of complex interconnected electronic components, which include resistors, capacitors, transistors, diodes and fuses.
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National Technical Systems
Destructive Physical Analysis (DPA) is the process of disassembling, testing, and inspecting electronic components to verify the internal design, materials, construction, and workmanship. This process of sample inspection is used to help ensure that electronic components are fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for identification of production lot problems.
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PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Helius PFA -
Autodesk, Inc.
Helius PFA software provides powerful tools for enhanced FEA (finite element analysis) of composite structures, including progressive failure analysis.
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VHX-6000 Series -
Keyence
Next-generation optical microscope with a large depth-of-field and advanced measurement capabilities for inspection and failure analysis.
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XT V 160 -
Nikon Metrology, Inc.
The XT V 160 is specifically designed for x-ray inspection in production lines and failure analysis laboratories.
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Maintenance Reliability Group, LLC
MRG Labs follows grease sampling and analysis standards outlined in ASTM D7718 and ASTM D7918. Grease analysis is a valuable tool for determining the condition of the lubricant and discovering abnormal conditions in equipment that may otherwise lead to unexpected failures. Our customized grease test slates are designed to identify the specific failure modes that may be damaging the component.
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DSI International
The Integrated System Diagnostic Design or ISDD Tool Suite provides a start to finish solution for meeting all the diagnostic needs of system design. The ISDD design process is centered around functional modeling of systems which is used to develop the diagnostics and failure analysis necessary to fully support good system design. This includes: *Analysis of Fault Detection and Fault Isolation.*Analysis of critical failures and their impact upon safety.*Detecting and reducing false alarms caused by diagnostics.*The impact of prognostics upon fault detection/fault isolation and mitigation of critical failures.*Development of vehicle health management and troubleshooting diagnostics
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Dynamic Test Solutions
Engineer, Design, Fabricate & Assemble Custom Boards for:*Device Characterization and Verification*Bench Testing*Failure Analysis*General Laboratory Use
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AXI X1# Series -
Nordson Corporation
The X1# is a high-resolution, low-footprint and portable AXI system. It is a dedicated platform for FATP and advanced failure analysis applications in connection with smart devices.
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NX-Hivac -
Park Systems Corp.
Park NX-Hivac allows failure analysis engineers to improve the sensitivity of their measurements through high vacuum Scanning Spreading Resistance Microscopy (SSRM). Because high vacuum scanning offers greater accuracy, better repeatability, and less tip and sample damage than ambient or dry N2 conditions, users can measure a wide range of dope concentration and signal response in failure analysis applications.